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Wafer Substrate Processing Product List

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Break device for wafer and substrate processing

Break device for wafer and substrate processing

Introducing a break device compatible with 6-inch wafers! By exchanging the blade and table, it can accommodate wafers from 2 inches to 4 inches.

By using double-arm transport, we shorten the loading time of wafers. Additionally, by improving visibility, we reduce matching errors during image recognition. 【Features】 ■ Standard support for 6-inch wafers ■ Equipped with break recognition function ■ Improved throughput due to enhanced ring transport function ■ Improved operability due to enhanced image recognition function *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer Substrate Processing

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Scribe device wafer substrate processing

Scribe device wafer substrate processing

High speed, high quality! This is a semi-automatic scriber compatible with 4-inch wafers.

This is a semi-automatic scribing device compatible with 4-inch wafers, featuring independent processing axis, feed axis, and camera axis. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer Substrate Processing

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